Mts Packaging Engineer
2 weeks ago
Overview:
WHAT YOU DO AT AMD CHANGES EVERYTHING
We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world.
Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming and embedded.
Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world's most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.AMD together we advance_
Responsibilities:
THE ROLE:
THE PERSON:
KEY RESPONSIBILITIES:
- Drive
supplier engagement on continuous improvement, new capabilities ahead of need. - Cowork with AMD internal stakeholders on to drive external manufacturer on
New Product Introduction activities and Ramp Up readiness with suppliers. - Responsible for high volume manufacturing
yield, quality, cost and operation productivity improvements and sustaining activities
- Drive suppliers on
issue resolution and
issue prevention
- Drive suppliers to
meet key performance indices and host regular
technical reviews
- Plan and execute
change management from internal or external parties. - Conduct market intelligent analysis to identify
continuous improvement initiatives to define shortterm and longterm improvement plans. - Involve in
regional supplier management and
audit. - Overseas travelling as required.
- Assist in additional duties as deemed fit by supervisor.
PREFERRED EXPERIENCE:
- Strong knowledge in Flip Chip and Advanced Packaging. (operational experience in bumping/assembly/Lid&stiffener manufacturing are added advantage)
- Good knowledge in Semiconductor Materials.
- Track record of supplier management and drive suppliers towards operational excellence.
- Proven ability to manage projects and provide regular updates to senior management.
- Proven experience in New Product bringup.
- Good leadership and interpersonal relationship.
- Familiar with tools (JMP, minitab, failure analysis knowledges, package reliability knowledges, data analytics tools) and industry standard (ESD, Jedec, Automotive).
ACADEMIC CREDENTIALS:
- Bachelor/MS degree in Mechanical or Material or Chemical Engineering.
- 10 years of working experience in Backend Semiconductor.
- Preferably certified in Project Management Professional (PMP).
- Fluent in Mandarin and English both oral and written.
LOCATION:
Singapore
LI-JV1
Qualifications:
- Benefits offered are described: _AMD benefits at a glance_._
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