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Mts Packaging Engineer
2 weeks ago
Overview:
WHAT YOU DO AT AMD CHANGES EVERYTHING
We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world.
Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming and embedded.
Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world's most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.AMD together we advance_
Responsibilities:
THE ROLE:
THE PERSON:
KEY RESPONSIBILITIES:
- Coordinates market intelligent analysis to identify value engineering initiatives and derive short
- Organize and lead on cost initiative via Value Analysis Value Engineering (VAVE) to ensure cost saving realize on time and well tracked with close collaboration with external manufacturers/ material suppliers and internal stakeholders.
- Plan and execute systematically from conceptualization, feasibility study to implementation with endtoend coverage.
- Prepare & present _Executive Summary_ of projects.
- Overseas travelling as required.
- Assist in additional duties as deemed fit by supervisor.
PREFERRED EXPERIENCE:
- Strong knowledge in Flip Chip Packaging (while operational experience in bumping process, substrate manufacturing, Assembly manufacturing, is added advantage)
- Track record of development work leading to volume production in Semiconductor manufacturing.
- Good leadership and interpersonal relationship.
- Familiar with tools (JMP, minitab, failure analysis knowledges, package reliability knowledges, power BI) and industry standard (ESD, Jedec, Automotive)
- Wafer level fanout (WLFO) and Elevated Fanout Bridge (EFB) knowledge is an added advantage
ACADEMIC CREDENTIALS:
- Bachelor/MS degree in Mechanical or Material or Chemical Engineering
- 8 years of working experience in Backend Semiconductor.
LOCATION:
Singapore
LI-LL1
Qualifications:
- Benefits offered are described: _AMD benefits at a glance_._
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