Engineer, Advaced Package Assembly Tech Dev
3 days ago
**Our vision is to transform how the world uses information to enrich life for all.**
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
JR16801 ENGINEER, ADVACED PACKAGE ASSEMBLY TECH DEV
**Specific Responsibilities**:Advanced package technology (chip stacking, 2.5D or 3D) research and development
Familiar with assembly and packaging processes such as Tape and Reel, wafer thinning and encapsulation process, etc.
Familiar with EMC material characteristics and fabrication.
Familiar with package reliability tests.
Experience with SPC, JMP data analysis and DOE matrix design.
Process problem identification and solving using systematic troubleshooting techniques
Work effectively to produce cross sections cooperation.
**Qualifications**:MS or Ph.D. with an engineering major.
3 years or above experience in semiconductor process, assembly process, or substrate process technologies is must
Hands-on experience in 3DI/TSV device bumping and assembly process is preffered
Innovative with independent thinking.
Good team player with a high motivation.
Fluent communication in English.
**About Micron Technology, Inc.**
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
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