Senior Package Design Engineer

3 days ago

Singapore Micron Full time

**Our vision is to transform how the world uses information to enrich life for all.**

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

JR64723 Senior Package Design Engineer

**Responsibilities will include, but are not limited to**:

- Conduct feasibility studies for various package options and assess designs for manufacturability and reliability.
- Work closely with cross-functional team to address packaging design challenge in the area of layout, electrical, thermal, mechanical, assembly and reliability.
- Interact with PDE assembly team and external assembly subcontractor partners to recommend package solutions to meet customer and/or market requirements
- Generate and update assembly documents in database. Provide drafting and drawing support for package drawings, interposer drawings, and manufacturing drawings.
- Support package and DFMEA reviews with assembly engineering and subcon teams.
- Support package technology development, including material selection, process development, DOEs, and related activities
- Support package technology development, including material selection, process development, DOEs (Design of Experiments), and related activities.
- Track and drive program milestones to ensure timely development execution.
- Provide design support for thermal/mechanical/electrical simulation analysis.
- Support and contribute to the Global Design, Simulation and Substrate (GDSS) team on continuous improvement efforts such as:

- Global design alignment activities
- Continuous improvement efforts
- Package design rules
- Package roadmaps
- Competitive Analysis review

**Requirements**:

- Master (preferred) or Bachelor of Science degree in Electrical Engineering or Mechanical Engineering with a minimum of 5 years of experience in semiconductor packaging industry OR PhD graduates in Electrical Engineering
- Excellent communication skills, both oral and written in English.
- Excellent problem solving and analytic skills.
- Experience with Cadence SIP, APD and AutoCAD software tools is preferred.
- Good understanding of Silicon IP, floorplan and Signal/Power Integrity is a plus.
- Ability to work independently, prioritize and manage numerous projects with minimum supervision.
- A global perspective and the ability to work in a multicultural environment.

**About Micron Technology, Inc.**

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

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