Power Package Designers
2 days ago
Design with Customer support innovative package based on PEP technologies for Semiconductor Power Applications using IGBT, GaN, SiC and Si Mosfet devices with device driver integration where reasonable
- Perform design rule checks (DRC) and edit data to comply with manufacturing guidelines. (DFM)
- Identify limitations of the design and suggest improvements to meet DFM for new products. Provide feedback on process critical dimensions and product features.
- Itemize and correspond to design Issues with customers.
- Perform Package layout, identifying stackup specifications as appropriate and prepare designs for production
- Identify and lead any prototype work required in early design stage to verify use of new technology or concepts in product or process design to reduce risk and improve profitability.
- Recommend new design concepts and validate the concept feasibility using thermal/electrical modelling
- Follow the customer characterization and qualification of the power package
- Provide technical support to process engineers to evaluate and provide strategy for advanced processing / implementation of product packaging
- **Job Requirements**:
- Degree / Diploma in Electronic Engineering or equivalent
- Good engineering foundation and technical knowledge
- PCB / Substrate manufacturing knowledge
- 2D and 3D design know-how ( AutoDesk preferred )
- Background on semiconductor packaging and assembly processes
- Knowledge with semiconductor power packaging assembly (interconnection, epoxy encapsulation, thermal dissipation, electrical impedance)
- Good interpersonal, presentation & communication skills
- Passionate R&D with optimistic mindset
- Ability to research, develop and implement new technology and manufacturing techniques
- Well organized and independent and team player
- Must be willing to travel both international and domestic as required to remote plants, facilities, customers or suppliers.
- Senior/Staff level with at least 5 years experience in related field.
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