Packaging Engineer

1 week ago

Bedok, Singapore Advanced Micro Devices, Inc Full time

Overview:
**WHAT YOU DO AT AMD CHANGES EVERYTHING**

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.

AMD together we advance_

**Responsibilities**:
**THE ROLE**:
Being in External Manufacturing Operations (Backend Engineering), you will be driving supplier engagement with external manufacturer on delivering key performance indices in terms on project management, new product introduction, supplier manufacturing readiness and excursion free processes of change management.

**THE PERSON**:
You will be a natural team player who is committed to meeting deadlines/ lead and drive for solutions and an aptitude to thrive and an ability to work in a fast-paced multi-tasking environment. He or she will have cross functional project management, conflict management, with strong interpersonal skills with good executive presentation as well as communication skills. We are looking for a strong leader.

**KEY RESPONSIBILITIES**:

- Drive supplier engagement on projects that yield result in cost/ function/ business continuity.
- Drive external manufacturer on issue resolution and issue prevention.
- Plan and execute change management from internal or external parties with issue-free ramp-up/ production.
- Work cross-functionally to develop project schedules, budgets, technical deliverables and monitor progress to ensure goals are met.
- Producing accurate and timely reporting of project executive summary throughout life cycle.
- Regional supplier management and travelling for this purpose is part of the role.

**PREFERRED EXPERIENCE**:

- Strong knowledge in Flip Chip Packaging (with operational experience in HBM manufacturing process, Flip Chip Assembly manufacturing is added advantage)
- Track record of development work leading to volume production in Semiconductor manufacturing.
- Proven experience in project management of material engineering.
- Good leadership and interpersonal skills.
- Familiar with tools (JMP, minitab, failure analysis knowledges, package reliability knowledges) and industry standard (ESD, Jedec, Automotive).

**ACADEMIC CREDENTIALS**:

- Bachelor/MS degree in Mechanical or Material or Chemical Engineering
- 10 years of working experience in Backend Semiconductor

**LOCATION**:
Singapore

LI-JV1

LI-Hybrid

Qualifications:

- Benefits offered are described: _AMD benefits at a glance_._

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