Packaging Engineer

3 days ago

Bedok, Singapore Advanced Micro Devices, Inc Full time

Overview:
**WHAT YOU DO AT AMD CHANGES EVERYTHING**

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.

AMD together we advance_

**Responsibilities**:
**THE ROLE**:
**THE PERSON**:
**KEY RESPONSIBILITIES**:

- Drive **_supplier engagement_** on continuous improvement, new capabilities ahead of need and value engineering activities.
- Drive **_New Product Introduction_** activities and Ramp Up readiness with suppliers.
- Drive suppliers on **_issue resolution_** and **_issue prevention._**:

- Drive suppliers to **_meet key performance indices_** and host half yearly **_technical reviews._**:

- Plan and execute **_change management _**from internal or external parties.
- Work cross-functionally to **_develop value engineering schedules, budgets, technical deliverables and monitor progress_** to ensure goals are met.
- Involve in **_regional supplier management _**and**_ audit_**.
- Drive continuous business process improvement on **_Analytics automation_**.
- Overseas travelling as required.
- Assist in additional duties as deemed fit by supervisor.

**PREFERRED EXPERIENCE**:

- Strong knowledge in Flip Chip and Advanced Packaging. (operational experience in bumping/assembly/substrate manufacturing are added advantage)
- Good knowledge in Semiconductor Materials. (lid/stiffener, adhesives, substrate, underfill)
- Track record of supplier management and drive suppliers towards operational excellence and issue resolution.
- Proven experience in leading projects (CIP/change management/cost saving).
- Proven experience in New Product bring-up, and value engineering projects.
- Good leadership and interpersonal relationship.
- Familiar with tools (JMP, minitab, failure analysis knowledges, package reliability knowledges) and industry standard (ESD, Jedec, Automotive).

**ACADEMIC CREDENTIALS**:

- Bachelor/MS degree in Mechanical or Material or Chemical Engineering.
- 10 years of working experience in Backend Semiconductor.
- Added advantage with Project Management Professional (PMP) certified,
- Fluent in Mandarin and English both oral and written.

**LOCATION**:
Singapore

LI-JV1

LI-Hybrid

Qualifications:

- Benefits offered are described: _AMD benefits at a glance_._

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