Staff Engineer, Packaging
6 days ago
Key expert for molding process (incl. transfer molding, FAM, compression molding) on substrate/panel and wafer level & lead the development of FO-WLP for module program.
**Responsibilities**:
- Direct responsible individual (DRI) of module packaging development, specific in molding process as key expert
- Major responsibilities include development, characterization and qualification of processes in terms of equipment, material and process parameters (recipe).
- Applies detailed technical expertise; uses technology to achieve work objectives; develops job knowledge and expertise (theoretical and practical) through continual professional development.
- Key contributor of given projects; publication of patents, inventions or new proposals to improve project technical outputs.
**Requirements**:
- Minimum 5 years of relevant experience in packaging R&D or manufacturing environment with minimum 3 years in molding process related process development
- Degree in Materials/ Mechanical/ Electrical/ Chemical Engineering
- Strong knowledge of SPC, FMEA, DOE and statistical analysis software such as JMP or Minitab, which includes (but not limited to) process capability, variability, regression prediction, multi-variate correlation analysis, etc
- Extensive knowledge on molding process, including experience with various types of mold press & tool, and molding compound
- Able to understand and interpret technical drawings with good understanding of GD&T standards
- Experience in 2D or 3D mechanical design software such as AutoCAD and/or Solidworks will be a plus
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