Member of Technical Staff

Overview Member of Technical Staff / Principal Product Engineer (Package PE) at Micron Technology. As the MTS / Principal Product Engineer (Package PE), you will lead a top-performing team focusing on Package and HBM Product engineering within the HBM Product and System Engineering Team. Responsibilities Cumulative Yield Ownership: Lead initiatives that significantly enhance overall cumulative yield and quality, delivering substantial benefits for the organization. Reduce Time 0 DPM: Improve assembly-related coverage in manufacturing flows to reduce time to production. Enhance HBM Cube Yield: Collaborate with Technology Development and Packaging teams to enhance test coverages and boost HBM Cube yield. Root Cause and Resolution of Qual and RMA Packaging Issues: Debug and identify root causes of failures through Electric Failure Analysis (EFA) and Physical Failure Analysis (PFA), driving resolutions through cross-functional collaboration. Support and Progress: Provide support to foster progress and development among team members within the team and organization. Cross-Functional Collaboration: Partner with Fab, HBM Technology Development, HBM Design, and Quality/Reliability teams to ensure full development and successful shipping of end products. Promotion of Innovation: Foster innovation and technical advantages that preserve Micron's competitive edge. Project Management: Develop project oversight to ensure timely delivery of technology solutions. Technical Decision Making: Make final decisions on risk analysis and project prioritization, influencing the direction of development. AI/ML Advocate: Build and assess AI/ML models to improve metrics such as Quality, Cost, Cycle Time, and Scale. Additional Responsibilities Subject Matter Expert: Serve as the go-to expert in your domain, guiding decision-making and strategy. Leading Complex Projects: Define and drive critical multi-disciplinary projects to ensure successful execution. Organization Spokesperson and Expert: Act as the main contact, providing detailed analysis on project and technical issues. Nurturing Potential Leaders: Guide and support team members to develop upcoming technical leaders. Innovation and Improvement: Continuously seek and implement innovative solutions to improve processes and technologies. Requirements Bachelor's/Master's in Electrical/Electronic/Mechanical Engineering with over 10 years of semiconductor industry experience, preferably in Product Engineering and Advanced Packaging. Strong leadership and technical skills, especially in problem-solving with root cause understanding and solution space through in-depth circuit analysis. Proficiency in statistics and data analysis tools and scripting. Highly motivated with a flexible approach to adapt to dynamic roles. Proven track record of collaborative work within/across teams to address complex business and engineering problems. Strong sense of responsibility and professional ethics. Excellent communication, collaboration, and presentation skills. Passionate about people leadership and ongoing development in this area. About Micron Micron Technology, Inc. is a leader in memory and storage solutions, delivering high-performance DRAM, NAND, and NOR products. We focus on customers, technology leadership, and manufacturing excellence to enable advances in AI and 5G from data centers to the intelligent edge. To learn more, please visit micron.com/careers Equal Employment Opportunity All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran status, or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact #J-18808-Ljbffr