Senior Staff Optical Packaging Design Engineer

1 day ago

Singapore MARVELL ASIA PTE LTD Full time

Responsibilities Develop photonics IC (PIC) and electronics IC (EIC) co-packaging and assembly process flow with OSAT partner.. Define PIC and EIC hybrid integration packaging design rules, process flow, and material sets. Lead optical package development to establish package manufacturability and reliability. Define PIC and EIC IO pad frame and 2.5D interposer floor plan. Develop PIC and EIC interconnect schematic and layout design process. Collaborate with cross-functional teams consisting of Digital and Analog Circuit designers, Signal/Power Integrity, and substrate layout, and system design team. Drive optical product package qualification activities from initial concept to production. Requirements Bachelor's degree in Computer Science, Electrical Engineering or related fields and 5-10 years of related professional experience. Master's degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3-5 years of experience. Familiarity or direct development or production experience in designing hybrid multi-chip integration using 2.5D/3D packaging. Direct experience in device or package characterization and testing as required in the development environment. High speed testing background is preferred. A strong understanding of wafer level packaging process flow. Ability to work on MCM package signal/power integrity is plus. Experience in MCM package mechanical drawing is a plux. Direct experience in collaborating with major OSAT for developing advanced packaging technology for high-speed optics and/or electronics IC is a plus. Ability to work with a large body of data and the necessary statistical analysis tools, and the ability to present the data and ideas to a diverse audience. Effective communication and presentation Team player. Expected to work with cross-functional team.

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