Software Engineer – Thermocompression Bonder Control Systems
2 weeks ago
Position Summary:
The Software Engineer will be responsible for developing precision motion and process control software for next-generation Thermocompression Bonders used in advanced semiconductor packaging. The role requires deep expertise in real-time control, sensor feedback loops, and multi-axis coordination to achieve sub-micron positioning, sub-Newton bonding force, and tight temperature regulation.
Key Responsibilities:
- Architect and implement real-time motion control software for multi-axis (X, Y, θ, Z) precision systems.
- Develop closed-loop PID and adaptive control algorithms for force, height, and thermal control subsystems.
- Integrate temperature, displacement, and force feedback loops for nanometer-level repeatability.
- Design software interfaces for heater ramp-up and dwell control (±5 °C accuracy).
- Collaborate with mechatronics and EE teams to synchronize control timing across motion, force, and temperature domains.
- Optimize bond process cycles using advanced motion trajectories and event synchronization.
- Develop diagnostic and calibration routines for alignment, tilt, and Z-force verification.\
- Implement data logging and predictive diagnostics for machine health and precision drift.
Required Qualifications:
- Bachelor's or Master's in Computer Engineering, Control Systems, or Mechatronics
- 5+ years of experience in real-time motion or robotic control.
- Expertise in C/C++, Python, and IEC PLC programming (TwinCAT, Codesys, or similar).
- Experience with EtherCAT-based motion systems and real-time operating systems (RTOS).
- Strong understanding of multi-axis kinematics and control loop tuning.
Preferred Qualifications:
- Experience in semiconductor assembly equipment software.
- Familiarity with dSPACE, Speedgoat, or National Instruments (NI) CompactRIO platforms.
- Experience with Beckhoff TwinCAT 3, ACS Motion Control SPiiPlus, or Delta Tau PMAC control architectures.
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