Product Specialist for Exposure and Bonder System

Product Specialist for Exposure and Bonder system 3 days ago Be among the first 25 applicants Product Specialist - Bonder system (SG)Do you think strategically, are you interested in the dynamic market of the Semiconductor Industry and promote the success of innovative technologies? Take responsibility for the success of our products and solutions, develop...

Product Specialist for Exposure and Bonder systemSingaporeFull-timePermanentInnovative products for renowned customers in a future-oriented, international market - that is SUSS MicroTec. The SUSS Group, headquartered in Garching near Munich, develops and manufactures process solutions for microstructure applications in the semiconductor industry and related...

Software Engineer – Thermocompression Bonder Control Systems The Software Engineer will be responsible for developing precision motion and process control software for next-generation Thermocompression Bonders used in advanced semiconductor packaging. The role requires deep expertise in real-time control, sensor feedback loops, and multi-axis coordination...

Position Summary:We are seeking a highly skilled Mechatronics Engineer to join our Thermocompression Bonder (TCB) development team. The ideal candidate will possess strong experience in precision motion control systems, force sensing and feedback, and thermal-mechanical alignment technologies. This role is central to the design and optimization of...

Head of Process Engineering – Thermo-Compression Bonder Systems PYXIS CF Pte Ltd is a Singapore-based developer of next-generation Thermo-Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration. Our engineering programs are anchored in Singapore to support leading semiconductor...

Head of Process Engineering – Thermo-Compression Bonder Systems PYXIS CF Pte Ltd is a Singapore-based developer of next-generation Thermo-Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration. Our engineering programs are anchored in Singapore to support leading semiconductor...

**Position Summary**: The Software Engineer will be responsible for developing precision motion and process control software for next-generation Thermocompression Bonders used in advanced semiconductor packaging. The role requires deep expertise in real-time control, sensor feedback loops, and multi-axis coordination to achieve sub-micron positioning,...

Position title : Laser-Assisted Bonder (LAB) process engineer Location: Sembawang Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced...

Position Summary:The Software Engineer will be responsible for developing precision motion and process control software for next-generation Thermocompression Bonders used in advanced semiconductor packaging. The role requires deep expertise in real-time control, sensor feedback loops, and multi-axis coordination to achieve sub-micron positioning, sub-Newton...

About PYXIS CF PYXIS CF Pte Ltd is a Singapore-based developer of next‐generation Thermo‐Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration. Our engineering programs are anchored in Singapore to support leading semiconductor manufacturers and global OSATs. We are expanding our...