Mechatronics Engineer – Thermocompression Bonder Development
2 weeks ago
Position Summary:
We are seeking a highly skilled Mechatronics Engineer to join our Thermocompression Bonder (TCB) development team. The ideal candidate will possess strong experience in precision motion control systems, force sensing and feedback, and thermal-mechanical alignment technologies. This role is central to the design and optimization of high-accuracy bonding systems for advanced semiconductor packaging applications such as HBM, CoWoS, and 2.5D integration.
Key Responsibilities:
- Design and develop precision motion stages for X-Y-θ-Z control, ensuring sub-micron positioning accuracy under thermal load conditions.
- Integrate and calibrate force and load cell sensors for precise bonding pressure control and real-time feedback.
- Develop control algorithms for closed-loop micro Z and force management during the TCB bonding cycle.
- Engineer and tune precision alignment systems that maintain stability and accuracy at elevated bonding temperatures.
- Collaborate with control engineers to implement advanced motion profiles for synchronized actuation and heating sequences.
- Design and qualify high-ramp heating systems with uniform temperature profiles and minimal mechanical distortion.
- Develop tilt and collimation measurement systems for parallelism correction between bonding surfaces.
- Support system integration, testing, and process validation for prototype and production-level TCB platforms.
- Work with cross-functional teams including mechanical design, process, and software engineers to ensure system reliability and performance.
Required Qualifications:
- Bachelor's or Master's degree in Mechatronics, Mechanical Engineering, Electrical Engineering, or Precision Engineering.
- 5+ years of experience in precision motion systems, robotics, or semiconductor assembly equipment development.
- Proven expertise in motion control systems, servo tuning, and PID-based control architecture.
- Hands-on experience with force/torque sensing, load cell calibration, and signal conditioning.
- Deep understanding of thermal effects on precision alignment systems and methods to compensate for expansion and drift.
- Experience in micro Z and force control for bonding, dispensing, or pick-and-place systems.
- Knowledge of high ramp heating mechanisms (e.g., induction, resistive, or infrared heating).
- Familiarity with collimation and tilt measurement (e.g., autocollimator, interferometer, or laser-based metrology).
- Strong proficiency in MATLAB/Simulink, LabVIEW, or similar motion control and data acquisition platforms.
Preferred Qualifications:
- Experience with semiconductor packaging equipment, especially Thermocompression Bonder, Flip-Chip, or Die Bonder systems.
- Exposure to finite element modeling for thermal-mechanical behavior analysis.
- Working knowledge of industrial automation communication protocols (EtherCAT, CANOpen, etc.).
- Familiarity with precision metrology tools and cleanroom equipment integration.
Personal Attributes:
- Strong analytical and problem-solving skills with a systems-thinking mindset.
- Highly detail-oriented, organized, and results-driven.
- Excellent communication and cross-disciplinary collaboration abilities.
- Self-motivated and able to thrive in a fast-paced R&D environment.
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