Head of Process Engineering – Thermo-Compression Bonder Systems
2 weeks ago
About PYXIS CF PYXIS CF Pte Ltd is a Singapore-based developer of next‑generation Thermo‑Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration. Our engineering programs are anchored in Singapore to support leading semiconductor manufacturers and global OSATs. We are expanding our technical leadership team to accelerate the Alpha build of our HBM‑class TCB platform targeted for 2026. Position Overview The Head of Process Engineering will lead the definition, development, and qualification of next‑generation TCB bonding processes and their translation into equipment capability requirements.The role requires deep hands‑on experience in flux‑less thermal compression bonding, formic‑acid/N₂ environments, and precision die‑to‑substrate assembly at fine pitch (< 50 µm).This position reports directly to the CEO and will collaborate closely with the Head of Equipment Engineering and software control teams. Key Responsibilities Lead process development for flux‑less Thermo‑Compression Bonding (TCB) for advanced packaging (HBM, CoWoS, 2.5D/3D). Define critical‑to‑quality (CTQ) parameters and Design Validation Plan & Report (DVP&R) frameworks for bonding yield, die tilt, and warpage control. Establish and maintain formic‑acid bonding environment and N₂ tunnel process standards. Correlate process responses with equipment parameters (Z‑axis control, force‑temperature loops, heater uniformity, clamping pressure). Develop and own process FMEA, SPC, and predictive maintenance metrics. Interface with customers and partners (e.g. Micron Singapore, regional OSATs) for process qualification and yield improvement. Coach and build a local team of process and integration engineers; drive knowledge
-
Singapore Pyxis CF Full timeHead of Process Engineering – Thermo-Compression Bonder Systems PYXIS CF Pte Ltd is a Singapore-based developer of next-generation Thermo-Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration. Our engineering programs are anchored in Singapore to support leading semiconductor...
-
Head of Process Engineering
1 week ago
Singapore Pyxis CF Full timeHead of Process Engineering – Thermo-Compression Bonder Systems PYXIS CF Pte Ltd is a Singapore-based developer of next-generation Thermo-Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration. Our engineering programs are anchored in Singapore to support leading semiconductor...
-
Singapore PYXIS CF PTE. LTD. Full timeRoles & Responsibilities About PYXIS CF PYXIS CF Pte Ltd is a Singapore-based developer of next-generation Thermo-Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration.Our engineering programs are anchored in Singapore to support leading semiconductor manufacturers and global OSATs....
-
Head of Process Engineering
2 weeks ago
Singapore Pyxis CF Pte Ltd Full timeAbout PYXIS CF PYXIS CF Pte Ltd is a Singapore-based developer of next‐generation Thermo‐Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration. Our engineering programs are anchored in Singapore to support leading semiconductor manufacturers and global OSATs. We are expanding our...
-
Singapore PYXIS CF PTE. LTD. Full time $120,000 - $180,000 per yearAbout PYXIS CFPYXIS CF Pte Ltd is a Singapore-based developer of next-generation Thermo-Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration.Our engineering programs are anchored in Singapore to support leading semiconductor manufacturers and global OSATs. We are expanding our...
-
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeTCB (Thermo Compression Bonding) Design Engineer (Fluxless) - Oxygen & Environmental Control Systems Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview The Mechanical Design Engineer will be responsible for designing systems to control and optimize oxygen levels during...
-
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeTCB (Thermo Compression Bonding) Design Engineer (Fluxless) - Oxygen & Environmental Control Systems Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role OverviewThe Mechanical Design Engineer will be responsible for designing systems to control and optimize oxygen levels during Thermal...
-
TCB Design Engineer
2 weeks ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment...
-
TCB Semiconductor Packaging Design Engineer
2 weeks ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for...
-
TCB Semiconductor Packaging Design Engineer
2 weeks ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeTCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced...
