
Staff Engineer End of Line Adhesion
2 days ago
Staff Engineer End of Line Adhesion & Plating - you are required to establish and setup new assembly process capabilities for adhesion and plating processes. Join us if you enjoy problem-solving on challenges related to Plating Process in IC Packaging Assembly Process Flow, have in-depth knowledge in Plating process, equipment, materials, and their interactions.
In your new role you will:
- Establish and **setup new assembly process **capabilities for adhesion and plating processes
- **Identify problems **or deviations and **recommend **and implement corrective actions
- Support **new package development, ramp up, platform extensions **and innovations.
- Perform **data gathering **according to **Process Development Handbook **requirements and record into **Statistical Process Control **database.
- Conduct **process knowledge transfe **r to Manufacturing team.
- Ensure all lesson learnt are well explained and understood.
You are best equipped for this task if you have:
- Education qualification in Master / Bachelor Degree in Chemical/Materials/Process Engineering.
- Minimum **5 Years **of **IC/Semiconductor assembly industry.**:
- Possess in-depth knowledge in **Plating process, equipment, materials **, and their interactions.
- Independent with good communication and coordination skills
- Demonstrates an ability to lead a team for **problem-solving**:
- Analytical mind and high initiative to challenge him/herself to move the next level of competency.
- Knowledgeable in **IC Packaging Assembly Process Flow.**:
- Experience in analytical tools (i.e. **JMP, 8D, FMEA, SPC, DMAIC **approach to problem solving) and design of experiments.
Singapore is our regional headquarter for Asia-Pacific and consists of production, research & development, sales & marketing, supply chain and many central functions.
**Part of your life. Part of tomorrow.**
Infineon is a world leader in semiconductor solutions that make life easier, safer, and greener. Our solutions for efficient energy management, smart mobility, and secure, seamless communications link the real and the digital world.
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