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Package Development Engineer Flip Chip, Die Attach, Thermal Compression Bonding
2 weeks ago
**Our vision is to transform how the world uses information to enrich life for all.**
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
JR70196 Package Development Engineer Flip Chip, Die Attach, Thermal Compression Bonding
We are looking for a motivated and experienced individual contributor to join its team as a Package Development Engineer Flip Chip, Die Attach, Thermal Compression Bonding
**Responsibilities**:
- Developing, configuring, and optimizing Package Assembly processes (front end, bonding and back end) for Micron’s memory from pathfinding through to NPI start up and certification in partnership with Manufacturing teams.
- Assessing processes by knowledge and skills, taking measurements and interpreting data
- Assembly design rules development working side by side with Design teams (Globally). You will be involved in the design approvals (Substrates, Carrier, Silicon), running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board).
- An important topic is the path finding of innovative package technology: Deep fundamental understanding of the key risks in Bumping and Flip chip technologies. Actual experience with FC (Flip Chip) and CUF (Capillary Underfill), Die attach process is a must
- Hands on integration experience in Pkg Assembly and WL package process are needed. You may need to conduct the supplier interactions/meetings and drive new NDAs with new projects, which all together requires a significant understanding of processes, first principles and process control systems.
Experience needed:
- Masters/bachelor's degree in electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics, or equivalent work experience required.
- At least 5 years of experience in the semiconductor industry with proven knowledge and skills in Die attach, Flip Chip, Thermal Compression Bonding (TCB), and Hybrid bonding both hands on and theory
- Hands on experience in Die Attach, DCA, TCB, Hybrid bonding Fasford, Besi, Canon, is a must
- Excellent critical thinking skills and familiarity with data-driven analysis, statistical analysis, and data interpretation.
- Strong project management skills and ability to multitask to ensure the execution of timelines.
- Strong collaboration skills to collaborate closely with diverse teams and gain insights into business needs and customers' requirements.
- Deep fundamental understanding of key risks in Semiconductor processes
Keen on the role? Join us today
**About Micron Technology, Inc.**
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
