Application / Process Engineer - Die Bond Tools
5 days ago
Company Overview
Capcon Limited Ltd. is a leading provider of high-performance equipment and innovative solutions for the advanced semiconductor assembly and packaging industry. In response to increasing market demand for next-generation packaging technologies, Capcon delivers cutting-edge solutions powered by a world-class engineering team. Our product portfolio includes Flip-Chip Bonders, Chip-on-Wafer Bonders, Package-on-Package (PoP) Bonders, Stack Die Bonders, Panel-Level Die Bonders, and Multi-Chip Die Bonders, among others. We are committed to driving innovation in semiconductor backend processes to support emerging packaging architectures and heterogeneous integration.
Position Overview
Capcon is seeking a highly motivated and skilled
Application/Process Engineer
to join our Advanced Control & Test (ACT) team. This role is instrumental in supporting the development, optimization, and deployment of advanced die bonding applications for next-generation semiconductor packaging. The successful candidate will work cross-functionally to improve software and hardware integration, conduct root cause analysis, enhance process capability, and provide hands-on support to both internal teams and customers. This position requires a strong technical background, a proactive mindset, and a passion for driving technology adoption and continuous improvement in high-precision semiconductor equipment.
Key Responsibilities
Lead the
design, development, optimization, and validation
of software and hardware applications for advanced die bonding processes.
Analyze customer requirements and translate them into customized semiconductor packaging solutions, focusing on
process optimization and application performance .
Conduct
troubleshooting and failure analysis
of die attach tools, process issues, and software application anomalies; implement corrective actions to enhance tool stability and reliability.
Perform
machine setup, calibration, and alignment
to ensure optimal process performance, repeatability, and yield.
Develop
test procedures, application recipes , and documentation for process qualification and validation; maintain detailed logs and technical reports.
Collaborate with
R&D, software, mechanical, electrical, quality , and manufacturing teams to address technical challenges and implement design or process improvements.
Provide
on-site support
for complex customer applications, including training and coaching for field application engineers and customers to ensure proper tool usage and maximize system capabilities.
Serve as a key interface between
customers and the R&D team , delivering user feedback to guide tool enhancements and feature development.
Qualifications
Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Materials, or related field).
3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred.
Strong knowledge of
advanced packaging technologies , such as Flip-Chip, PoP, wafer-level, or panel-level bonding.
Experience with
semiconductor equipment integration , motion control systems, and process development.
Hands-on troubleshooting and problem-solving skills in a high-tech manufacturing or lab environment.
Excellent communication and interpersonal skills; ability to work independently and in cross-functional teams.
Willingness to travel for customer support and on-site installations (as required).
#J-18808-Ljbffr
-
Singapore CAPCON SINGAPORE PTE. LTD. Full timeCompany Overview: Capcon Limited Ltd. is a leading provider of high-performance equipment and innovative solutions for the advanced semiconductor assembly and packaging industry. In response to increasing market demand for next-generation packaging technologies, Capcon delivers cutting-edge solutions powered by a world-class engineering team. Our product...
-
Singapore CAPCON SINGAPORE PTE. LTD. Full time $80,000 - $120,000 per yearCompany Overview: Capcon Limited Ltd. is a leading provider of high-performance equipment and innovative solutions for the advanced semiconductor assembly and packaging industry. In response to increasing market demand for next-generation packaging technologies, Capcon delivers cutting-edge solutions powered by a world-class engineering team. Our product...
-
Singapore CAPCON SINGAPORE PTE. LTD. Full timeCompany Overview: Capcon Limited Ltd. is a leading provider of high-performance equipment and innovative solutions for the advanced semiconductor assembly and packaging industry. In response to increasing market demand for next-generation packaging technologies, Capcon delivers cutting-edge solutions powered by a world-class engineering team. Our product...
-
Singapore CAPCON SINGAPORE PTE. LTD. Full timeRoles & Responsibilities Company Overview: Capcon Limited Ltd. is a leading provider of high-performance equipment and innovative solutions for the advanced semiconductor assembly and packaging industry. In response to increasing market demand for next-generation packaging technologies, Capcon delivers cutting-edge solutions powered by a world-class...
-
Senior Die Bonding Applications Engineer
7 days ago
Singapore beBeeSemiconductor Full timeAdvanced Die Bonding Applications Engineer We are seeking a skilled and motivated Application/Process Engineer to join our team, responsible for designing, developing, and optimizing advanced die bonding processes. Job Description: Develop and implement software and hardware applications for die bonding processes. Analyze customer requirements and...
-
Die Attach
2 weeks ago
Singapore MEDS TECHNOLOGIES PTE LTD Full timeSetup and operate assembly equipment for epoxy dispensing, die attach, wire bonding, plasma cleaning, epoxy curing, pull/shear testing, leak testing, etc. - Execute Design of Experiments (DOEs) to develop new assembly processes or improve existing ones. - Provide input to engineering teams on the producibility of new designs. - Help develop assembly...
-
Advanced Semiconductor Bonding Specialist
2 weeks ago
Singapore beBeeSemiconductor Full time $90,000 - $120,000Advanced Semiconductor Bonding ExpertWe are seeking a highly skilled professional to lead the development, optimization, and deployment of advanced die bonding applications for next-generation semiconductor packaging.Develop and optimize software and hardware applications for advanced die bonding processes.Analyze customer requirements and translate them...
-
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeOverview Position title: TCB (Thermo Compression Bonding) Process Engineer Location: North Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $5000 - $8000 (depends experience)Interested applicants can also send your resume to WA: (Ms Angel) and allow our Consultant to match you with our Clients. No Charges will be incurred by Candidates for...
-
Principal Tooling Engineer
1 day ago
Singapore CVISTA HR CONSULTING PTE. LTD. Full time**Responsibilities**: - To Lead the tooling team in problem-solving, identifying problems, and analysis of root causes. - Liaise with the various departments; design, manufacturing, and planners on the progress to ensure effective tooling and achieving 100% on-time delivery. Analyze stamping processes and identify opportunities for process optimization,...
-
Senior Semiconductor Process Specialist
2 weeks ago
Singapore beBeeEngineering Full time**Application Engineer Role** "> We are seeking a highly motivated and skilled Application/Process Engineer to join our Advanced Control & Test (ACT) team. This role is instrumental in supporting the development, optimization, and deployment of advanced die bonding applications for next-generation semiconductor packaging. The successful candidate will work...
