Senior Die Bonding Applications Engineer

11 hours ago

Singapore beBeeSemiconductor Full time

Advanced Die Bonding Applications Engineer

We are seeking a skilled and motivated Application/Process Engineer to join our team, responsible for designing, developing, and optimizing advanced die bonding processes.

Job Description:

  • Develop and implement software and hardware applications for die bonding processes.
  • Analyze customer requirements and create customized semiconductor packaging solutions.
  • Troubleshoot and resolve issues with die attach tools, process problems, and software application anomalies.
  • Set up, calibrate, and align machines to ensure optimal process performance.
  • Create test procedures, application recipes, and documentation for process qualification and validation.

Required Skills and Qualifications:

  • Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials, or related field).
  • 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing.
  • Strong knowledge of advanced packaging technologies, such as Flip-Chip, PoP, wafer-level, or panel-level bonding.
  • Experience with semiconductor equipment integration, motion control systems, and process development.
  • Hands-on troubleshooting and problem-solving skills in a high-tech manufacturing or lab environment.

Benefits:

This role offers the opportunity to work on cutting-edge projects, collaborate with cross-functional teams, and develop technical expertise.

Others:

This position requires a strong technical background, excellent communication skills, and the ability to work independently and in teams.

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