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Staff and Senior Packaging Engineer

3 weeks ago


Singapore Advanced Micro Devices Full time

WHAT YOU DO AT AMD CHANGES EVERYTHING
We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world's most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.
AMD together we advance_
THE ROLE:
The Power Integrity and Signal Integrity engineering team ensures the performance of the product are met through the integration of silicon, package and platform electrical design. Singapore Signal Integrity team provides design support to engineering teams for both current and forward-looking product development and design optimization.
THE PERSON:
As a member of the Singapore Signal Integrity team, you will be responsible for the electrical design and characterization of high-speed signaling and power delivery networks in AMD products covering package, connector and board. You will be required to communicate effectively and work in close collaboration with others in AMD to ensure optimal engineering design decisions and efficient problem solving.
KEY RESPONSIBILITIES:
Simulate electrical performance of package, connector and board designs from Signal Integrity perspective.
Collaborate with internal and external teams to optimize Signal / Power Integrity on high-speed channels from transmitter-package-connector-board-receiver.
Co-design with multiple discipline experts for optimal cost-performance.
Drive and support design schedules and participate in necessary meetings.
Develop and improve upon best practices in Signal / Power Integrity simulations.
PREFERRED EXPERIENCE:
Experience in silicon, packaging, connector and board design for power & signal integrity designs.
Experience in electrical modeling EDA tools such as Cadence, Ansys HFSS, SIwave, ADS, etc.
Experience in high-speed digital signaling interfaces such as PCIE, USB, UCIE, GDDR and DDR.
Experience in SI/PI simulation and processing of s-parameters.
Experience in test board design, measurement fixtures and de-embedding methodologies.
Knowledge in analog characterization, electromagnetic theory and digital circuit analysis is a plus.
Experience in measurement tools VNA, TDR and high-speed oscilloscope is a plus.
Skills in developing and mentoring team members is another plus.
Ability to collaborate and work across different functional teams and different sites.
Self-driven and can work independently.
> 5 years relevant experience preferred.
ACADEMIC CREDENTIALS:
Bachelor's or Master's degree in Electrical or Microwave Engineering or a related field.
LOCATION:
Singapore
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