Senior/Engineer, Advanced Packaging Die Level Technology

2 days ago


Singapore Micron Technology Full time

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team focused on using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help enable everything from virtual reality experiences to breakthroughs in neural networks, while committing to integrity, sustainability, and giving back to communities. We are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) delivers package development for high performance memory products and



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