Principal/Senior Engineer, Advanced Packaging Die Level Technology Engineering
2 hours ago
Overview
Micron Technology is seeking a Senior Principal Mechanical/Packaging Engineer to join our Advanced Packaging Technology Development (APTD) team. This role focuses on developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will collaborate with peers and partners across organizations to coordinate development and launch of new technologies and integration flows for solutions that drive the future of memory products.
Responsibilities
Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.
Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity.
Establish and improve process management projects to deliver technology node requirements.
Evaluate and promote new equipment and materials to enhance process capabilities.
Set up process parameters for a variety of semiconductor equipment.
Evaluate, promote, and plan for new equipment and materials.
Ensure defense coverage through process, measurement, inspection, and testing.
Establish correlations between defense mechanisms to identify improvement opportunities.
Conduct continuous data analysis to establish advanced controls and identify improvement opportunities.
Collaborate with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives.
Work with teams including Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality to integrate manufacturing processes for optimal performance and quality control.
Ensure smooth transition from new product development, qualification, small volume production to high volume production.
Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product
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