Principal/Senior Engineer, Advanced Packaging Die Level Technology Engineering Singapore, Singapore
3 days ago
## Principal/Senior Engineer, Advanced Packaging Die Level Technology EngineeringSingapore, Singapore**Micron’s vision is to transform how the world uses information to enrich life *for all*.**Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and
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Singapore Micron Technology Full time $120,000 - $200,000 per yearOur vision is to transform how the world uses information to enrich life for all.Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all...
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Singapore Micron Technology Full timeOverview Principal/Senior Engineer, Advanced Packaging Wafer Level Technology Engineering at Micron Technology. Responsibilities Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability,...
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Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full timeMicron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we...
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Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full timeMicron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we...
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Singapore Micron Technology Full time $120,000 - $180,000 per yearOur vision is to transform how the world uses information to enrich life for all.Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all...
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Singapore Micron Memory Malaysia Sdn Bhd Full time## Engineer, Advanced Packaging Die Level Technology EngineeringSingapore, SingaporeAbout Micron Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic...
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Singapore Micron Technology Full timeSenior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization (CMP) / Grinding page is loaded Senior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization (CMP) / Grinding Apply locations Fab 10A, Singapore time type Full time posted on Posted Yesterday job requisition id JR76640 Our vision...
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Singapore Micron Technology Full timeSenior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization (CMP) / Grinding page is loadedSenior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization (CMP) / Grinding Apply locations Fab 10A, Singapore time type Full time posted on Posted Yesterday job requisition id JR76640Our vision is to...
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Singapore GLOBALFOUNDRIES Full time**About GlobalFoundries** **Introduction**: Globalfoundries Singapore is seeking highly skilled and motivated Experienced Equipment Engineer to become part of our starting 300mm Advance Packaging Center, Singapore. **Responsibilities**: - Designing, executing, and analyzing experiments to develop advanced packaging etch processes to meet technology (e.g....
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Application / Process Engineer - Die Bond Tools
2 weeks ago
Singapore CAPCON SINGAPORE PTE. LTD. Full timeCompany Overview Capcon Limited Ltd. is a leading provider of high-performance equipment and innovative solutions for the advanced semiconductor assembly and packaging industry. In response to increasing market demand for next-generation packaging technologies, Capcon delivers cutting-edge solutions powered by a world-class engineering team. Our product...
