Lithography Master

2 days ago

Singapore ADVANCED SUBSTRATE TECHNOLOGIES PTE. LTD. Full time

Job Responsibilities Process Development & Optimization You'll own lithography development for advanced packaging solutions. Developing manufacturable, repeatable, and high-yielding processes. Improving processes for cost reduction, cycle time reduction, and yield enhancement. Collaborating with cross-functional teams to lead innovations in lithography and their implementation efforts Drive the industry with advanced lithography solutions, for panel lithography Equipment & Tooling Support Active part of defining lithography equipment specifications and validating tools. Work with cross-functional team to monitor and maintain tool performance. Yield & Quality Improvement Implement and refine process monitoring techniques and defect inspection, to proactively investigate and resolve lithography defects. Collaborate with upstream and downstream process owners (e.g., plating, deposition, etching) to ensure seamless integration. Support the development of process flows for advanced packaging substrates. Data Analysis & Documentation Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters. Document standard operating procedures (SOPs), work instructions, and control plans. Cross-Functional Collaboration Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale-up and new product introduction (NPI). Process Integration Assist with customer qualifications and reliability testing as needed. Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.Job Requirements Professional Qualifications: PhD or Master's degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field. 5-10+ years of experience in lithography development Specialized Knowledge & Skills: Experience with defect analysis tools (e.g., optical inspection, SEM, AFM). Familiarity with process integration for advanced packaging (e.g., 2.5D/3D IC, interposers). Strong analytical, documentation, and problem-solving skills. Good communication and teamwork in a cross-functional environment. Familiarity with using metrology tools for thin film and etch characterization (e.g., XRF, 4PP, ellipsometry, profilometer). Takes part in product risk management discussions leveraging his / her expertise and knowledge to influence and drive risk management decisions. Using AI/ML to enhance process discovery Support lithography related metrology such as CD-SEM / Filmmetrics / Inspection / Defect Review and be able to create recipes and run wafers independently.

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