CMP Process Master
2 days ago
Job Responsibilities Process Development & Optimization Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric, etc.) in advanced substrate manufacturing. Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness. Equipment & Tooling Support Define equipment specifications and validate CMP tools. Monitor and maintain CMP tool performance, including pad conditioning, slurry delivery systems, and endpoint detection technologies. Yield & Quality Improvement Investigate and resolve CMP-related defects (e.g., dishing, erosion, scratching, delamination). Implement process monitoring techniques like thickness metrology (e.g., ellipsometry, profilometry) and defect inspection. Process Integration Collaborate with upstream and downstream process owners (e.g., plating, lithography, etching) to ensure seamless integration. Support the development of process flows for advanced packaging substrates including SAP/ Damascene, ABF/PI/PID-based technologies. Data Analysis & Documentation Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters. Document standard operating procedures (SOPs), work instructions, and control plans. Cross-Functional Collaboration Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale-up and new product introduction (NPI). Assist with customer qualifications and reliability testing as needed. Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.Job Requirements Professional Qualifications: PhD or Master's degree in Materials Science, Chemical Engineering, Mechanical Engineering, or a related field. 5-10+ years of experience in CMP process development in semiconductor packaging, wafer fabrication, or substrate manufacturing. Hands-on experience with CMP tools. Solid understanding of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding. Specialized Knowledge & Skills: Experience with defect analysis tools (e.g., optical inspection, SEM, AFM). Familiarity with process integration for advanced packaging (e.g., 2.5D/3D IC, interposers). Knowledge of slurry chemistry, pad materials, and post-CMP cleaning processes. Strong analytical, documentation, and problem-solving skills. Good communication and teamwork in a cross-functional environment.
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Principal CMP Process Engineer
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Singapore NXP Semiconductors Full timePrincipal CMP Process Engineer page is loaded Principal CMP Process Engineer Apply locations Singapore time type Full time posted on Posted Today job requisition id R- We are looking for Process Engineer role in preparation for the formation of the joint venture of NXP and VIS, known as VSMC. Job Description This posting is for a CMP and/or Wafer Bond...
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Principal CMP Process Engineer
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Singapore NXP Semiconductors Full timeGet AI-powered advice on this job and more exclusive features. We are looking for Engineering roles in preparation for the formation of the joint venture of NXP and VIS, known as VSMC. This posting is for a CMP and/or Wafer Bond Process Engineer in a high volume, 300mm wafer manufacturing environment. The qualified candidate must possess process knowledge of...
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Singapore Qualcomm Full timeOverview Senior CMP Process Engineer role at Qualcomm Job description content provided includes details about responsibilities, qualifications, and corporate information. The text contains multiple repetitive sections and formatting issues that need to be refined for clarity and proper HTML structure. Responsibilities Drive cost reduction, weed out...
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