IC Packaging Design Lead Engineer/ Manager

1 week ago


Singapore AMQ Full time

Overview
AMQ Semiconductor is seeking an IC Packaging Design Lead Engineer or Manager to join our team in Singapore. You will be responsible for the development of advanced package technology solutions for new products including CPU, GPU, DSP, and other high-end IC devices. Day-to-day tasks include overseeing packaging design projects, ensuring quality control, conducting research on new packaging techniques, and collaborating with cross-functional teams to meet project goals and timelines.
Responsibilities
Design and Development
- Identify and develop innovative packaging solutions for new products; Lead package substrate design and development; in charge of final design review; Generate package design rules based on Signal/Power Integrity team input; co-design with SI/PI team for design sign-off; maintain database of package solutions and assembly; Create design and assembly documents, instructions, and application notes for internal use and customer approval
Project Management
- Interact with end customers to ensure timely product delivery and acceptance criteria; Interface with substrate suppliers for new product development and production ramp; Interface with assembly, bumping and testing teams to achieve efficient product delivery; Provide knowledge of OSAT flow, cost model and capabilities to enable supplier selection, qualification, and audits, and evaluating technology roadmaps
Leadership
- Mentor junior designers to improve layout practices and implement design rules
Qualifications
A Degree in Electrical Engineering, Computer Science, or related field
In-depth knowledge and understanding of IC packages and assembly process with more than 8 years of experience in IC packaging design
Experience in complex packaging substrate design, with at least 8 layers in substrate layout
Experience in FCBGA
Software proficiency in Cadence APD, SIP software
Strong analytical and problem-solving skills
Multi-task capability with strong sense of responsibility
Self-driven and result oriented
Good verbal and written communication skills
Strong collaborator with ability to work effectively with other team members outside of Singapore
Proficiency in English and Chinese, both spoken and written
Knowledge in Signal Integrity, Power Integrity principles; Perl or Skill scripting is a plus
Experience in dealing with assembly, foundry and substrate vendors is a plus
About AMQ
AMQ is a global leader in advanced packaging OSAT, offering state-of-the-art FC-SiP and 3D-SiP packaging solutions serving industry leaders across various industries including AI, computing, blockchain, crypto, robotics, telecom, consumer electronics, and automotive. Our innovative packaging solutions drive higher than usual performance and efficiency in cutting-edge technologies; winning multiple awards with record breaking innovations and 100+ patents. Join the team today pioneering the next generation of technological advancements.
Seniority level: Mid-Senior level
Employment type: Full-time
Job function: Information Technology
Industries: Semiconductor Manufacturing
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