Advanced Wafer Integration Expert
10 hours ago
Seeking a highly skilled and experienced R&D Engineer to lead next-generation multi-layer stacking for hybrid bonding development.
- Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs.
- Develop expertise in processes, materials and tooling leveraging available characterization resources. Develop integration schemes to continuously improve yields and reduce cycle time & costs.
- Collaborate with vendors and OSATs to develop new wafer level and die level 2.5D and 3DHI processes.
- Drive understanding of failure modes.
- Facilitate advanced packaging interactions between Product Line/Fab teams and customers.
- Generate IP related to novel wafer integration & packaging technology.
Required Skills:
- Education: Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering or Materials Science from an accredited degree program.
- MS degree with at least 12 years of prior related work experience.
- Must have at least an overall 3.0 GPA and proven good academic standing.
- Language Fluency: English (Written & Verbal).
- Travel: Up to 20%.
Benefits:
- Perform all activities in a safe and responsible manner and support Environmental, Health, Safety & Security requirements and programs.
- Take part in hiring of other Advanced Packaging team members in Singapore.
- Mentor and guide new hires to assume their roles and responsibilities.
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