Advanced Packaging Integration Expert
4 weeks ago
Seeking a development integration engineer to lead advanced packaging process integration, focusing on die-to-wafer (D2W) and wafer-to-wafer (W2W) bonding solutions for ULP CMOS platforms. The role spans from early-stage process development through to manufacturing transfer.
Key ResponsibilitiesDevelop and optimize process flows and recipes for defect-free, high-reliability manufacturing
Lead integration of new advanced packaging features on FINFET and FDSOI platforms
Coordinate device testing and ensure robust inspection & control methodologies
Analyze performance, reliability, and defect data to drive improvements
Freeze qualified processes and support production ramp-up
Cross-functional collaboration and occasional reporting to internal/external stakeholders
Ensure compliance with EHS&S requirements
Ideal RequirementsB.S. in EE, Materials Science, or related field (M.S./Ph.D. preferred)
8-12+ years' experience in advanced packaging, integration, R&D, NPI, or module development
Strong in DOE, lot handling, data analysis (inline/HOL/ET)
If you would like to be considered for this opportunity, please forward a copy of your full CV to
Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.
Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614
If this job isn't quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer SGD1,000 or SGD350 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply.
Advanced Packaging Integration Expert - D2W / CMOS #J-18808-Ljbffr-
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