Semiconductor Packaging Expert

6 days ago

Singapore beBeeThermocompression Full time $90,000 - $120,000
Job Overview

A semiconductor packaging expert is required to design, develop, and optimize TCB modules subsystems used in Thermo-Compression Bonding equipment. This critical role ensures precise thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities:
  • Design & Development
  1. Develop innovative TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
  2. Create 3D designs, 2D drawings, BOM management plans, FMEA reports, error budgets, and Design for Manufacturability and Assembly (DFMA).
  3. Plan, schedule, and cost machine module projects.
Prototyping & Testing
  1. Oversee the fabrication of prototype modules and their integration with TCB platforms.
  2. Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
Process & Manufacturing Support
  1. Collaborate with Electrical, Vision, and Software Engineers for machine integration.
  2. Work with process teams to improve bonding machines, including bonder heads, stages, temperature/power controls.
  3. Ensure safe and robust assembly of module systems by collaborating with manufacturing engineers.

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