Wafer Level Packaging Engineering Lead
7 days ago
Job Opportunity
We are seeking a seasoned leader to drive engineering success in Singapore. The ideal candidate will possess significant experience in wafer level packaging, with at least 15 years of experience in a similar role.
Main Responsibilities:
- Understand customer needs and meet/exceed customer expectations.
- Lead the team in establishing stable manufacturing processes with high reliability.
- Drive cost, yield, and quality improvement through statistical process control.
- Provide training for Process Managers and Engineers.
- Implement FDC and SPC on key equipment.
- Collaborate with cross-functional teams to meet production schedules, quality, and safety standards.
- Resolve customer engineering issues.
- Plan and direct all aspects of engineering activities.
Required Qualifications:
- Degree in Electrical/Electronics/Mechanical/Chemical Engineering or equivalent with minimum 15 years of engineering experience in wafer fab or wafer bumping house, with at least 5 years management experience at Director/Deputy Director level.
- Thorough knowledge of wafer level packaging, engineering, and production.
Key Skills:
- Statistical process control.
- Manufacturing process optimization.
- Leadership and management.
- Customer relationship management.
Benefits:
The successful candidate will have opportunities for career growth and professional development.
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