
Wafer Manufacturing Lead
6 days ago
Key Responsibilities:
- Strategic leadership in establishing stable manufacturing processes with CpK >1.67.
- Driving engineering discipline through the use of DOEs and Statistical Process Engineering tools for cost, yield, and quality improvement.
- Implementing FDC and SPC on key equipment.
- Collaboration with cross-functional teams to meet production schedules, quality, and safety standards.
- Customer engineering and issue resolution.
- Planning and directing all aspects of engineering activities.
- Leading continuous improvement initiatives in cost, yield, and quality.
- Establishing departmental KPIs.
Required Qualifications and Experience:
- Degree in Electrical/Electronics/Mechanical/Chemical Engineering/Chemistry or its equivalent with a minimum of 15 years of engineering experience in wafer fab or wafer bumping house, including at least 5 years of management experience at Director/Deputy Director level in a fast-paced environment.
- Thorough knowledge of wafer-level packaging, engineering, and production.
Preferred Skills:
- Engineering Management
- Autonomy
- Kanban
- Hardware
- Quality Improvement
- Scrum
- Manufacturing Processes
- Software Engineering
- Architects
- Agile
- Process Engineering
- SPC
- Packaging Engineering
- Product Development
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