Senior/ Engineer, Advanced Packaging Wafer Level Technology
4 hours ago
Senior/ Engineer, Advanced Packaging Wafer Level Technology - Post Wafer Fabrication(PWF)/ Assembly page is loaded
Senior/ Engineer, Advanced Packaging Wafer Level Technology - Post Wafer Fabrication(PWF)/ Assembly Apply locations Fab 10A, Singapore time type Full time posted on Posted Yesterday job requisition id JR76649
Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Micron's vision is to transform how the world uses information to enrich life for all.
Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.
We are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron's Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and
-
Singapore Micron Technology Full timePrincipal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering Join to apply for the Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering role at Micron Technology Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering 1 week ago Be among the first 25 applicants Join to apply for the...
-
Singapore Micron Technology Full timeSenior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization (CMP) / Grinding page is loadedSenior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization (CMP) / GrindingApply locations Fab 10A, Singapore time type Full time posted on Posted Yesterday job requisition id JR76640Our vision is to...
-
Singapore beBeePackaging Full time $180,000 - $250,000Job Title: Advanced Packaging Wafer Level Technology ExpertWe are seeking an accomplished professional to lead the development and implementation of advanced wafer level packaging technology.This innovative field is at the forefront of memory and compute advancements, driving progress in artificial intelligence (AI) applications.Micron's Advanced Packaging...
-
Senior Wafer-Level Packaging Specialist
3 days ago
Singapore beBeePackaging Full time $120,000 - $180,000Job Opportunity: Senior Packaging EngineerWe are seeking a skilled professional to fill the role of Senior Packaging Engineer. The ideal candidate will possess expertise in wafer-level packaging, advanced packaging, and process engineering.The successful candidate will be responsible for establishing new processes and tooling capabilities based on the unit...
-
Senior Research Engineer
3 days ago
Singapore A*STAR Agency for Science, Technology and Research Full timeResearch Engineer will be part of heterogeneous integration group focused on development of the advanced packaging technology platforms for multi-chip and high-density FOWLP. He/she will work on the following tasks: Plan and perform DOEs for various process development and materials evaluation for FOWLP Establish integration flows for advanced...
-
Singapore Micron Technology Full timeSenior Manager/ Manager, Advanced Packaging Technology Development, Post-Fabrication Wafer Finish (PWF)Join to apply for the Senior Manager/ Manager, Advanced Packaging Technology Development, Post-Fabrication Wafer Finish (PWF)role at Micron Technology Senior Manager/ Manager, Advanced Packaging Technology Development, Post-Fabrication Wafer Finish (PWF)6...
-
Singapore Micron Technology Full timeOverview MTS/ Principal/ Senior/Engineer, Advanced Packaging Integration - Post Wafer Fabrication (PWF) We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team focused on using...
-
Singapore Micron Technology Full timeJoin to apply for the Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering role at Micron Technology 6 days ago Be among the first 25 applicants Join to apply for the Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering role at Micron Technology Our vision is to transform how the world uses information...
-
Singapore beBeeEngineering Full timeJob Title:Advanced Packaging Die Level Technology Engineering LeaderJob Summary:The Advanced Packaging Die Level Technology Engineering Leader will be responsible for leading a team of engineers to develop and deploy advanced packaging technologies.Key Responsibilities:Develop and optimize assembly processes for advanced packaging technologies, including...
-
Advanced Packaging Technology Expert
10 hours ago
Singapore beBeePackaging Full time $120,000 - $180,000Job Title: Senior Advanced Packaging SpecialistWe are seeking a highly skilled and experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to lead next-generation multi-layer stacking for hybrid bonding development.Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across...
