Advanced Packaging Technologist

7 days ago

Singapore beBeePackaging Full time $125,000 - $175,000

Job Title: Senior Manager/ Manager, Advanced Packaging Technology Development, Post-Fabrication Wafer Finish

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Description:

">We are seeking a highly skilled and experienced Senior Manager/ Manager to join our Advanced Packaging Technology Development (APTD) team. As a key member of the team, you will be responsible for leading the post-fab wafer finish engineering to enable the deployment of advanced packaging technologies that meet performance, cost, manufacturability, quality, reliability, and schedule requirements.">

Your Key Responsibilities Include:

">* Develop and communicate advanced packaging technology development strategy.
* Develop and communicate advanced packaging technology development strategic objectives.
* Understand the impact and implications of APTD strategy to the overall company strategy and direction.
* Provide technical leadership that may influence company direction.
* Represent APTD in providing cross-departmental leadership in area of responsibility.
* Work effectively with peers in other departments to develop and drive multi-functional initiatives.
* Ensure accuracy, quality, and timeliness of results.
* Guide best utilization of resources to achieve end results.
* Ensure critical work, milestones, and goals are met by the team.
* Continue to build new skills through development goals and learning events.
* Seek out opportunities to work multi-functionally, build a network, and gain competency across domains.
* Conduct performance appraisals with team members to create goals and development plans.
* Mentor other engineers and engage in continued learning to stay updated with the latest advancements in packaging technology.">

Requirements:

">* B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields.
* 8 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control, and packaging field, preferably in Technology Development.
* Experience in equipment development with fundamental understanding of post-probe and assembly process and equipment interactions.
* Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability.
* Consistent track record to solve problems and address root causes.
* Ability to multi-task and manage numerous projects simultaneously.
* Tenacity to work effectively under timelines and limited resources.
* Validated ability to lead small and large teams, directly or indirectly, toward common goals.
* Outstanding communication and presentation skills, written and verbal to all levels of an organization.">

About Us:

">We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, we deliver a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

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