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Senior Advanced Packaging Technologist

3 weeks ago

Singapore beBeeEngineer Full time $200,000 - $350,000
Job Description

We are seeking a seasoned engineer to spearhead the development of advanced packaging technologies. As an Advanced Packaging Die Level Technology Engineer, you will play a pivotal role in designing and optimizing assembly processes for high-performance memory products.

The ideal candidate will possess a deep understanding of process flows, interactions, and how changes can impact yield, performance, and reliability. A strong background in semiconductor process development or equipment evaluation is essential.

Required Skills and Qualifications
  • Bachelor's/Master's/Ph.D. (or equivalent) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related fields.
  • 2+ years of experience in semiconductor process development or equipment evaluation, preferably in wafer bonding, die stacking, and packaging.
  • Proven expertise in design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis, and data analysis.
Benefits

This is an excellent opportunity to join a dynamic team that is shaping the future of memory and storage solutions. Our company is committed to innovation, integrity, and sustainability.

As a valued member of our team, you will have access to: