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Senior Technologist for Advanced Packaging Solutions

3 weeks ago

Singapore beBeeEngineering Full time $90,000 - $120,000
Job Title:

Fellow/Principle Engineer is responsible for establishing new processes & tooling capability based on unit process/equipment/material roadmap, related to advanced packaging, 2.5/3D, heterogenous integration, wafer-level packaging process technologies.

This role requires a deep understanding of semiconductor industry, process and equipment engineering, wafer-level packaging technology, AOI, and chip attachment methods. The ideal candidate will have strong knowledge of DOE, process control (Lean six sigma or DMAIC) and Statistical Tools, such as JMP.

The successful candidate will lead new equipment phase-in and commissioning in factory for new R&D and NPI projects, perform process, equipment and tooling capabilities reviews for New Technologies or New Products requirements, and interact with Business Units and Process Engineering team for new package and process development.

Required Skills and Qualifications:

  • Degree in Engineering (Mechanical/Chemical/Electrical Engineering or science in Chemistry/Physic)
  • Minimum of 10 years of experience in semiconductor industry, related to process and equipment engineering
  • Strong cross-functional teamwork, collaboration, interpersonal, written and business skills
  • Good communication skills in dealing with Business Units, suppliers and customers
  • Lead project across organization and culture in a fast-paced environment
  • Good analytical and problem-solving skills, and able to work independently with minimal supervision