Semicon Head of Operation

2 weeks ago

Singapur, Singapore People Profilers Full time

The Head of Operations – Wafer Level Dicing (WLD) is responsible for overseeing all WLD manufacturing operations, ensuring excellence in quality, cost, delivery, and innovation. Drives operational strategy, efficiency improvements, and performance excellence across manufacturing, process, and equipment functions to achieve world‑class operational results and customer satisfaction. Key Responsibilities Provide overall leadership and accountability for Wafer Level Dicing (WLD) Operations , including Manufacturing, Process, and Equipment functions. Own and drive operational performance metrics (KPIs) covering quality, cost, delivery, yield, and equipment reliability. Manage operational budgets, cost control, margin optimization, and efficiency improvement initiatives. Lead process and equipment optimization to improve throughput, yield, and manufacturing robustness. Develop and implement operational strategies and improvement programs to enhance production capability, capacity, and competitiveness. Foster strong customer relationships and ensure alignment of operations with customer requirements and business growth goals. Approve and manage departmental budgets, manpower plans, and capital investments. Champion continuous improvement, innovation, and operational excellence using Lean and Six Sigma methodologies. Build a high‑performing organization through leadership development, coaching, and succession planning for managers and engineers. Collaborate closely with cross‑functional teams (e.g., Quality, Planning, Engineering) to ensure smooth production flow and rapid issue resolution. Ensure all customer delivery commitments are met and effectively manage any manufacturing excursions or deviations. Lead initiatives to achieve top‑tier customer satisfaction, reduce quality incidents, and strengthen process capability. Drive Best Known Methods (BKM) sharing and implementation across business units and functions. Requirements Bachelor’s degree in Engineering or equivalent discipline; advanced degree preferred. Minimum 20 years of relevant experience in semiconductor manufacturing or wafer‑level packaging operations. Proven track record in leading large‑scale manufacturing operations with full accountability for cost, quality, and performance. Strong strategic and operational leadership, capable of translating business goals into executable operational plans. Deep technical expertise in wafer‑level manufacturing, process integration, and equipment engineering. Demonstrated proficiency in Lean Manufacturing, Six Sigma, and other continuous improvement methodologies. Excellent customer orientation, communication, and stakeholder management skills. Strong people leadership with the ability to motivate, develop, and retain high‑performing teams. Commitment to operational excellence, proactive quality management, and sustainable performance improvement. Benefits All successful candidates can expect a highly competitive remuneration package and a comprehensive range of benefits. Application Please email your resume in a detailed MS Word format to *****@peopleprofilers.com stating: 3) Date Available 4) Reason to Leave each job. We regret that only shortlisted candidates will be notified. EA License Number: 02C4944 Job ID: 93395R86 #J-18808-Ljbffr

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