Senior/principal Product Engineer
3 days ago
**Our vision is to transform how the world uses information to enrich life for all.**
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
As a member of the **HIG HBM (High Bandwidth Memory) Media Health HVM team**you will lead and develop a high-performing product driving Media Health Manufacturing and activities within the HBM Product and Systems Engineering Team.
You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization.
**Key Responsibilities**
- ** Optimized Test Coverage**: optimizing test coverage on all current and future HIG HBM products. This includes supporting the test time cut activities, test mode validation and Design verification, and participating in Design for Test (DFT) during NPI and HVM phases.
- ** Engineering Platform Enablement**: Developing and maintaining engineering tools/script/test program that are used for engineering works in HBM.
- ** Product Development and Validation**: Developing, validating, characterizing, and qualifying Micron’s next-generation HBM products meeting product specifications.
- ** Electrical Failure Analysis.** Design verification and in-depth circuit failure analysis of product yield loss and functional failures using tester and simulation.
- ** Yield Improvement and Cost Reduction: I**mproving product test yields and working with MFG to reduce test time meeting test time and yield targets.
- ** Root Cause and Resolution of Qual and RMA Device Issues**:Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized test flow and test strategy.
- ** Process Conversions**: Providing recommendation to fab teams for new process conversions to reduce cost, increase yields and improving product quality, reliability, and performance of HBM products
- ** Project Management**: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.
**Requirements**:
- Bachelors/Masters Electrical Engineering Degree with 10+ years of experience in the semiconductor industry.
- Demonstrating Strong Leadership Skills and Technical Skills 10+ years of experience in the semiconductor industry.
- Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).
- Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.
- Strong sense of responsibility and accountability towards assigned role with professional work ethic.
- Work on site in Singapore with international travel to USA, Taiwan and Japan.
**About Micron Technology, Inc.**
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
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