Process Engineer Tape/dicing
2 weeks ago
**Company**: RF360 Singapore Pte., Ltd. **Job Area**: Engineering Group, Engineering Group > Hardware Engineering **General Summary**: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. **Minimum Qualifications**: - Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. **Preferred Qualifications**: - Degree in Mechanical / Material / Electrical / Electronic / Chemical Engineering. - Experience working in a high-volume and high product mix manufacturing environment. Preferably in Semi-conductor Assembly manufacturing. **Principal Duties and Responsibilities**: - Applies Hardware knowledge to assist in the planning, optimization, verification, and testing of electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems. - Provides support for the integration of features and functionality into hardware designs in line with proposals or roadmaps. - Assists in conducting simulations and analyses of designs as well as with the implementation of designs with the best power, performance, and area. - Collaborates with team members to assist in the implementation of new requirements and incorporation of the latest test solutions in the production program to improve the yield, test time, and quality. - Assists in the evaluation, characterization, and development of manufacturing solutions for leading edge products in processes and bring up product to meet customer expectations and schedules. - Assists in the evaluation of reliability for materials, properties, and techniques and brings innovation, automation, and optimization to maximize productivity. - Assists in the assessment of common design features to identify potential flaws, compatibility issues, and/or compliance issues. - Writes technical documentation for Hardware projects. **Level of Responsibility**: - Works under supervision. - Decision-making affects direct area of work and/or work group. - Requires verbal and written communication skills to convey basic, routine factual information. - Tasks require multiple steps which can be performed in various orders; some planning, problem-solving, and prioritization must occur to complete the tasks effectively. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. If you would like more information about this role, please contact Qualcomm Careers.
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Dicing Process Engineer
3 days ago
Singapore HEPTAGON PHOTONICS PTE. LTD. Full timeThe Dicing Process Engineer plays a critical role in enabling high-yield, high-precision wafer singulation for advanced semiconductor and photonics products. This position is essential to the company’s mission of delivering cutting-edge microfabrication solutions by developing robust, scalable, and cost-effective dicing processes for glass and silicon...
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Dicing Process Engineer
4 days ago
Singapore Heptagon Photonics Pte Ltd. Full timeJob Description The Dicing Process Engineer plays a critical role in enabling high-yield, high-precision wafer singulation for advanced semiconductor and photonics products. This position is essential to the company's mission of delivering cutting-edge microfabrication solutions by developing robust, scalable, and cost-effective dicing processes for glass...
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Dicing Process Engineer
1 week ago
Singapore HEPTAGON PHOTONICS PTE. LTD. Full time $100,000 - $150,000 per yearJob DescriptionThe Dicing Process Engineer plays a critical role in enabling high-yield, high-precision wafer singulation for advanced semiconductor and photonics products. This position is essential to the company's mission of delivering cutting-edge microfabrication solutions by developing robust, scalable, and cost-effective dicing processes for glass and...
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Equipment Associate Engineer
1 week ago
Singapore SILICON BOX PTE. LTD. Full time**Position Summary** The **Equipment Associate Engineer (Backend)**is responsible for maintaining and supporting backend equipment operations, including setup, repairs, and preventive maintenance. The job incumbent is expected to work closely with engineering and manufacturing teams on equipment qualification, new product introduction, and continuous...
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Mechanical Design Engineer
6 days ago
Singapore The Supreme HR Advisory Full timeLocation: Admiralty Street Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $6000 - $8000 (depends experience)Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging equipment. The candidate should have hands‐on experience in ejecting ultra‐thin dies (down to...
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TCB Design Engineer
1 week ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for...
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TCB Design Engineer
7 days ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor...
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TCB Design Engineer
2 weeks ago
Singapore The Supreme HR Advisory Full timeLocation: Sembawang Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging equipment. The candidate should have hands‐on experience in ejecting ultra‐thin dies (down to 25...
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Design Engineer
2 weeks ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeTCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages)Location: 8 Admiralty Stree Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $6000 - $8000 (depends experience)Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging...
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Design Engineer
1 week ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeTCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: 8 Admiralty Stree Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor...