Dicing Process Engineer
2 weeks ago
The Dicing Process Engineer plays a critical role in enabling high-yield, high-precision wafer singulation for advanced semiconductor and photonics products. This position is essential to the company’s mission of delivering cutting-edge microfabrication solutions by developing robust, scalable, and cost-effective dicing processes for glass and silicon substrates. The engineer will drive innovation in wafer-level processing, support new product introductions, and ensure manufacturing excellence through continuous process improvement.
**Job Requirement**
- Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or related field.
- Minimum 5 years of hands-on experience in wafer dicing process development, preferably in semiconductor or photonics industries.
- Proven track record of developing and scaling dicing processes for glass and silicon wafers.
- Deep understanding of wafer materials, mechanical properties, and dicing-induced stress.
- Proficient in common tools such as IE, SPC, PFMEA, CP, MSA, and NPI.
- Familiarity with Cleanroom practices and wafer handling protocols.
- Strong Problem-solving and communication skills.
- Strong Team spirit, sense of respeonsibility, result-oriented mindset and practical work ethics.
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Singapore HEPTAGON PHOTONICS PTE. LTD. Full timeJob Description The Dicing Process Engineer plays a critical role in enabling high-yield, high-precision wafer singulation for advanced semiconductor and photonics products. This position is essential to the company’s mission of delivering cutting-edge microfabrication solutions by developing robust, scalable, and cost-effective dicing processes for glass...
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