Senior Bonding/Dicing/Grinding Equipment Engineer
5 days ago
Senior Bonding/Dicing/Grinding Equipment Engineer Responsibilities Establish effective preventive maintenance programs and equipment troubleshooting guide. Executive new equipment start-up, from facilities hook-up, vendor start-up, to acceptance of equipment for production. Establish stock levels of essential spares and consumables to support equipment maintenance-based forecasted manufacturing volume. Actively evaluate 2nd source part as part of cost reduction plan. Drive/ contribute in equipment fault investigations and continuous equipment improvement project (CIP) to resolve chronic equipment issues, and institute permanent resolutions to assure product quality and enhance process robustness. Enforce on controls and execution to conform to work instructions and procedures. Apply hands-on and with deep involvement at work. Take accountability of work and possesses strong sense of responsibility and teamwork. Manage vendor services and supports and ensuring compliance with factory protocol. Perform other duties assigned. Duties are varying according to project progress and/or for specific goal of the department. Manage vendor services and supports and ensuring compliance with factory protocol. Establish, review and perform regular update of PM procedures, Risks Assessments and Troubleshooting guidelines. Create technical specification for new and transferred equipment. Execute the equipment move-in, installation, set up and buy-off, meeting set timelines. Compliance with CSR, EHS, QM, ESD, 5S standard and cleanroom protocol. Education/Experience Requirements Minimum Bachelor’s degree in Electronic or Electrical Engineering or equivalent. Minimum 4 years of related work experience in wafer process engineering and/or equipment maintenance. Hands-on experience in troubleshooting of Wafer-Bonder or/and Wafer-Dicer/Grinder. Experience in high volume production of electronics components in an MNC or semi-conductor industry. Possess strong technical competencies in his field of study. Good knowledge of statistical and quality tools. Able to work under pressure and with strong commitment at work. Experience with computer systems and proficient with software applications such as MS Power Point, Excel and Word. Be careful - Don’t provide your
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Process Engineer
1 week ago
Singapore Qualcomm Full timeJoin to apply for the Process Engineer - Wafer-Bonder-Dicing-Grinding role at Qualcomm Job Area : Engineering Group, Engineering Group > Hardware Engineering Company : RF360 Singapore Pte., Ltd. General Summary : As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital...
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Equipment Engineer
1 week ago
Singapore Qualcomm Full time2 days ago Be among the first 25 applicants Job Area Engineering Group, Engineering Group > Hardware Engineering Company RF360 Singapore Pte., Ltd. General Summary As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected...
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Senior Process Engineer
3 days ago
Singapore Nutanix Full timeCompany: RF360 Singapore Pte., Ltd. Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware...
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Senior Engineer
1 week ago
Singapore Micron Full time**Our vision is to transform how the world uses information to enrich life for all.** Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it...
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Senior Engineer
2 weeks ago
Singapore Micron Technology Full timeSenior Engineer - Bond/Grind/Trim Process Dev 1 week ago Be among the first 25 applicants Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything...
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Equipment Engineer
2 days ago
Singapore Qualcomm Full time $40,000 - $120,000 per yearCompany:RF360 Singapore Pte., Ltd.Job Area:Engineering Group, Engineering Group > Hardware EngineeringGeneral Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer,...
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Equipment Engineer
2 days ago
Singapore Qualcomm Full time $60,000 - $120,000 per yearCompany:RF360 Singapore Pte., Ltd.Job Area:Engineering Group, Engineering Group > Hardware EngineeringGeneral Summary:As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer,...
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Senior Engineer/principle Engineer/mts
5 days ago
Singapore Micron Full time**Our vision is to transform how the world uses information to enrich life for all.** Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it...
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Dicing Process Engineer
2 weeks ago
Singapore HEPTAGON PHOTONICS PTE. LTD. Full timeThe Dicing Process Engineer plays a critical role in enabling high-yield, high-precision wafer singulation for advanced semiconductor and photonics products. This position is essential to the company’s mission of delivering cutting-edge microfabrication solutions by developing robust, scalable, and cost-effective dicing processes for glass and silicon...
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Dicing Process Engineer
1 week ago
Singapore HEPTAGON PHOTONICS PTE. LTD. Full timeJob Description The Dicing Process Engineer plays a critical role in enabling high-yield, high-precision wafer singulation for advanced semiconductor and photonics products. This position is essential to the company’s mission of delivering cutting-edge microfabrication solutions by developing robust, scalable, and cost-effective dicing processes for glass...