Lead Principal Engineer Package Technology

1 week ago

Singapore Infineon Technologies Full time

Principal role within OSAT Development focusing in package development, technology integration and delivering solution in highly complex FE/BE technology interactions.

In your new role you will:

- Principal role within OSAT Development focusing in package development, technology integration and delivering solution in highly complex FE/BE technology interactions.
- Responsible for package design tasks in OSAT segment which specialising in WLP and laminates/BGA package technology.
- Technical advisor for OSAT in package technology development (i.e. to specify requirements, to develop, verify, validate new - or to modify existing - package technologies).
- Make technical decision and set direction within OSAT in development and pre-development of new package technologies, processes and materials.
- Drive problem solving, hypothesis prioritization, using clear systematic approach to draw conclusions out of analysis and derives lesson learned.
- Drive subcon partners to ensure projects are managed within time, budget and scope of project.

You are best equipped for this task if you have:

- More than 15 years of package development and process development (assembly & test) working experience.
- Minimum 5 years in NPI and change/transfer projects
- Excellent technical knowledge of BE processes and materials in WLP/laminate packages and interaction to the different functions (laminate design, interaction of BOM, package construction, design rules and process).
- Good understanding of Automotive quality requirements and standards
- Bachelor’s / Master’s Degree in Engineering or Physics.

Singapore is our regional headquarter for Asia-Pacific and consists of production, research & development, sales & marketing, supply chain and many central functions.

**Part of your life. Part of tomorrow.**

Infineon is a world leader in semiconductor solutions that make life easier, safer, and greener. Our solutions for efficient energy management, smart mobility, and secure, seamless communications link the real and the digital world.

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