Principal/Senior Engineer, APTD CEM

14 hours ago


Singapore Micron Technology Full time

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering 2 days ago Be among the first 25 applicants Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Micron’s vision is to transform how the world uses information to enrich life for all. Join a world‑class global team focused on using our expertise in the relentless pursuit of innovation to enable high‑value technology‑driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in super‑computing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. We are currently experiencing a ground‑breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High‑bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible for delivering package development for high‑performance memory products and



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