Co-op/ Intern

5 days ago

Bedok, Singapore Advanced Micro Devices, Inc Full time

Overview:
**WHAT YOU DO AT AMD CHANGES EVERYTHING**

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. This is who we are at our best. One Company. One Team.

AMD together we advance_

**Responsibilities**:
Project Title : New methodologies for enhancing acoustic imaging and defect detection

**Project Overview**:
next generation packaging technologies FA has been discussed in reference [5]. The appropriate hardware

such as high-speed analogue-to-digital converter (ADC) for nano-seconds gating, transducers of suitable focal

length and frequency as well as active z-axis positioning of the transducer during C-scan are optimized for

high-resolution acoustic imaging of defect detection in 2.5D packages. However, deciphering acoustic signals

and images is becoming more challenging, especially as defects are shrinking with interconnect size and are

**Description of Main Project Scopes**:
The proposed project involves the exploration of newly developed software modules (wavelet analysis and deep learning automated defect detection) to aid in defect and feature detection in C-SAM. The intern will assist FA engineer to collect datasets for machines learning training, and explore the types of feature and defects that can

be enhanced using wavelet analysis. In addition, experimental work may include working on actual production

related analysis cases.

***

**Responsibilities**:
1. Collect acoustic image datasets (A-scans) from several types of semiconductor packages for training machine learning defect detection software.

2. Explore how wavelet analysis can be used to enhance feature / defect detection in stack die and other fine pitch interconnects.

3. Conduct trials on known used cases and actual failure jobs.

4. Document operation processes for wavelet and defect detection software.

5. Identify software bug and assist engineer to generate list of features that could be included in next iteration of the software development.

**What the Coop can expect to learn from this project**:
Gain industrial experience and knowledge about package level failure analysis, specifically in acoustic microscopy.

Get hands-on training in simple sample preparation for failure analysis.

Learn and be exposed to the most advance acoustic imaging methodologies being developed to improve defect detection,

and image resolution for next generation semiconductor packages.

**Skills Required / Technical Skills**
- (List specific skills preferred and state if training will be provided)Basic understanding of semiconductor packaging technologies and principles of acoustic imaging.- Someone with strong experimentation and analytical skills preferred.**Other Requirements / Soft Skills**

Good communication and presentation skills.

Have curiosity and initiative to pick up new knowledge.

Qualifications:

- Benefits offered are described: _AMD benefits at a glance
_._

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