Senior Package Process Engineer

About SiTime

SiTime Corporation is the precision timing company. Our semiconductor MEMS programmable solutions offer a rich feature set that enables customers to differentiate their products with higher performance, smaller size, lower power and better reliability. With more than 3 billion devices shipped, SiTime is changing the timing industry. For more information, visit

Job Summary

We are seeking a highly motivated and skilled Packaging Process Engineer to join SiTime in Singapore, focusing on Chip-on-Wafer (CoW) and Wafer-Level Chip Scale Packaging (WLCSP) technologies. In this role, you will be responsible for developing, optimizing, and sustaining advanced packaging processes to ensure high-quality and high-yield manufacturing. This is an excellent opportunity for a hands-on engineer to make a significant impact on cutting-edge semiconductor packaging technologies within a dynamic and innovative environment.

Responsibilities:

• Develop, optimize, and characterize packaging processes for CoW and WLCSP technologies, including but not limited to bumping, re-distribution layer (RDL) formation, underfill, dicing…
• Conduct process capability analysis (Cp/Cpk), implement statistical process control (SPC), and drive continuous improvement initiatives to enhance yield, quality, and cost-efficiency.
• Perform root cause analysis and implement corrective and preventive actions (8D methodology) for process-related issues and defects.
• Collaborate with R&D, design, equipment, and manufacturing teams to ensure seamless process transfer from development to high-volume manufacturing.
• Define and maintain process specifications, control plans, and standard operating procedures (SOPs).
• Evaluate and qualify new materials, equipment, and processes to support technology roadmaps and production requirements.
• Lead or participate in cross-functional teams for new product introduction (NPI) and process improvement projects.
• Provide technical support and training to manufacturing operators and technicians.
• Stay updated with the latest industry trends and advancements in packaging technologies.

Qualifications & Requirements (Education must be included):

• Bachelor's or Master's degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related discipline.
• Minimum of 5-15 years of experience in semiconductor packaging process engineering, specifically with strong knowledge of CoW and/or WLCSP technologies.
• In-depth understanding of packaging process flows, equipment, and materials (e.g., photoresists, polymers, solders, underfills).
• Proficiency in statistical analysis software (e.g., JMP, Minitab) and data interpretation.
• Experience with failure analysis techniques (e.g., SEM, EDX, Optical Microscopy, X-ray).
• Strong problem-solving skills and a data-driven approach to decision-making.
• Excellent communication, interpersonal, and teamwork skills.
• Ability to work independently and manage multiple projects simultaneously in a fast-paced environment.
• Fluency in English is required

Desired Characteristics & Attributes:

• Core Skills:
• Make things more efficient: They should be able to improve how the packaging line works. This means reducing waste, getting more products out the door, and fixing issues that cause shutdowns.
• Know their stuff: They need to understand different materials like plastic, glass, and cardboard, and how to work with a wide range of machines—from fillers and sealers to labelers.
• Keep quality high: A great candidate is dedicated to safety and quality standards, following rules like Good Manufacturing Practices (GMP).
• Personal Traits
• Problem-solver: They can find and fix complex issues on their own. They're proactive and don't just wait for problems to get worse.
• Detailed and thorough: They pay close attention to every detail to prevent errors that could lead to wasted products or costly mistakes.
• Good communicator: They can work well with everyone on the team—from the factory floor crew to the R&D department. They can explain technical problems clearly to anyone.
• Flexible: The manufacturing world is always changing. They need to be adaptable and able to handle unexpected challenges without getting stressed out.

The actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.

SiTime compensation packages includes base salary, bonus based on achieving your innovation goals and equity.

SiTime is an Equal Opportunity Employer. We treat each person fairly and we do not tolerate discrimination or harassment against anyone on the basis of any protected characteristics, including race, color, religion, national or ethnic origin, sex, sexual orientation, gender identity or expression, age, disability, pregnancy, political affiliation, protected veteran status, protected genetic information, or marital status or other characteristics protected by law. SiTime participates in the E-Verify program.

Learn More about SiTime: Review the Get to Know SiTime section of our career page to explore our culture, values, and what makes us unique.

• Innovation on Top – Philosophies of Innovation with Rajesh Vashist
• Fabrication Knowledge – An Interview with Rajesh Vashist
• SiTime Corporation – YouTube