Senior Engineer, Packaging Development Engineering, Technology Development Process Integration
1 week ago
**Our vision is to transform how the world uses information to enrich life for all.**
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
JR70399 Senior Engineer, Packaging Development Engineering, Technology Development Process Integration
**JOB DESCRIPTION**
This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.
**JOB RESPONSIBILITIES**
**Promote worldwide synergy**
- Improve benchmark performance and efficiency gains through global project management and execution
- Network BKM leveraging and enhancement, business process creation and re-engineering
- Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, GQ. Communicate
- Help drive to fix the issue where necessary
**Drive FE-AT Integration initiatives**
- Business process governance between Fab - Assembly (WSPEC, FE2BE forum, WPSWAT)
- Lead & drive FE-AT excursions
- Yield, DPM related issues that involves both Fab - Assembly
**Cross sites benchmark & achieve BIC yield performance**
- Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow
**Identify, Propose & Drive new initiatives programs**
- Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
- Process flow simplifications & standardizations
- Cross technology streamline (Process, tools, etc)
- Sites expansions process & qualification requirements
- Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)
**Requirements**:
- Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
- 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI).
- Strong background in frontend fabrication processes (FAB) is highly desirable.
- Proven experience in data analysis, statistical process control (SPC), and process optimization.
- Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
- Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
- Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
- Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
- In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.
**About Micron Technology, Inc.**
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
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