Semicon R&D Process Engineer

2 days ago


North Region, Singapore People Profilers Pte Ltd Full time

Our Client is a well establish Semicon company .

5 days week ; Monday- Friday

Role Overview:

Lead and develop wafer-level molding and related processes .

Focus is on process development, optimization, stabilization, and supporting transition to mass production.

Key Responsibilities:

  • Develop and optimize wafer-level molding and debonding processes for advanced packaging (2.5D, fan-out, SiP).
  • Conduct DOE (Design of Experiments), data analysis (e.g., using JMP), and continuous process improvement.
  • Qualify new materials, tools, and equipment for packaging and device integration.
  • Validate processes pre-production and stabilize yield.
  • Support customer programs with technical solutions and troubleshooting.
  • Review and improve FMEA, OCAP, and control plans.
  • Enhance molding, debond, and wafer resizing processes.
  • Drive process yield and quality improvements.
  • Support technical innovation in alignment with global customer needs.

Requirements:

  • Bachelor's degree in Mechanical, Materials, or Electronics Engineering.
  • At least 3 years' hands-on experience in wafer-level molding process engineering.
  • In-depth knowledge of molding machines, materials, procedures, and quality standards.
  • Familiarity with advanced packaging (2.5D, fan-out, flip-chip) and related processes (debonding, warpage, resizing).

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel:

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID: 8XY47V33



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