
Process Technician, Flip Chip
2 weeks ago
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The Opportunity:- Our client, Government-affiliated Science Agency
- Working Location: One-North Area
- Basic Salary: Up to $3,500 (commensurate with experience)
- Working hours: 4334, 9PM-9AM (Night shift only)
- Training provided (Training on normal shift)
- 1 year contract (Subjected to renewal/conversion)
- Operate and monitor semiconductor equipment and recover process errors.
- Execute process sequences and document tool parameters and die-level data.
- Transport wafer lots within cleanroom environments.
- Identify areas for improvement in cycle time, utilization, and cost.
- Specialize in flip chip bonding processes including solder bump formation, die alignment, bonding, underfill, and inspection.
- Understand and follow all Environmental, Health and Safety (EHS) procedures and requirements.
- Nitec/Higher Nitec in Engineering, Electronics, Mechatronics or related fields.
- Strong interest in hands-on technical work and learning from the ground up.
- Hard Skills: Machine calibration, die bonding, tool recovery.
- Soft Skills: Accurate documentation, adaptability, troubleshooting.
- Must be comfortable with night shift operations.
- Prepare your updated resume (please include your current salary package with full breakdown such as base, incentives, annual wage supplement, etc.) and expected package.
- Simply click on 'Apply here' to drop your resume.
- All shortlisted candidates will be contacted.
Jason Ng
Direct Line:
EA License No: 91C2918
Personnel Registration Number: R
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