R&D Engineer, Advanced Packaging

2 weeks ago

East Region, Singapore AlwaysHired Pte. Ltd. Full time $80,000 - $160,000 per year

Responsibilities

  • Drive 2.5D and 3DIC platform development, including new unit module and device innovation.
  • Lead new process verification and qualification to ensure production readiness and performance stability.
  • Support DSM platform setup and collaborate cross-functionally to establish process flow and integration standards.
  • Engage with customers for new product verification, performance review, and process optimization.
  • Work closely with internal teams to define process control plans, FMEA, and DOE for continuous improvement and issue resolution.

Requirements

  • Bachelor's degree or above in Microelectronics, Electrical/Electronic Engineering, Physics, Materials Engineering, or a related discipline.
  • Minimum 7 years of experience in semiconductor R&D or foundry environment, with focus on integration, process, or device engineering.
  • Strong knowledge of semiconductor device physics, process integration, and device characterization.
  • Hands-on experience with 2.5D/3DIC process or device development is a strong advantage.
  • Proficient in FMEA, DOE, control plan design, and structured problem-solving methodologies.
  • Highly motivated, proactive, and an effective communicator with a passion for technology innovation.

Interested candidates please apply online or send your latest CV to

AlwaysHired Pte Ltd

Reg No: R1549345

EA: 24C2293

We regret to inform that only shortlisted candidates will be notified. Please note that your response to this advertisement will constitute informed consent to the collection, use, and/or disclosure of personal data by AlwaysHired, its affiliates and, where necessary, to relevant third parties, for purposes such as job application processing, career advisory, research, and other administrative purposes, in compliance with the relevant provisions of the Privacy Policy available

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