Engineer (Die/ Wire Bonding - Training Provided)

Responsibilities:Develop and optimize bonding process parameters, including temperature, force, and timeTroubleshoot process deviations and work with customers on R&D requirementsHandle multi-tasks including Die Bonding, Wire Bonding, Optical alignment, and Rework processesRequirements:Minimum Diploma in Electronics / Mechatronic engineeringAt least 2 years...

Company Overview: Capcon Limited Ltd. is a leading provider of high-performance equipment and innovative solutions for the advanced semiconductor assembly and packaging industry. In response to increasing market demand for next-generation packaging technologies, Capcon delivers cutting-edge solutions powered by a world-class engineering team. Our product...

**Job responsibilities** - Provide support for Process Engineers on NPI/NPQ product trials - Support Engineers to create process parameters and run DOE trials for new product development - Support Process engineers on the safe launch/pilot run when new products are launched in the production phase - Support to collect data and information related to NPI/NPQ,...

Product and Technical development Support Provides support for Hybrid bond ultra-accuracy product setup & demo Conducts feasibility studies, sample bonding and generate report Builds-up strong technical know-how on product/problem solving via structured knowledge transfer between the on-site support team, the Product Line and the R&D team Ddefines DOE's,...

Position title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor...

**Description** - Work on process equipment to conduct proof of concept evaluation and DOEs - Establishment of baseline process and metrics - Perform process characterization - Establish design guidelines for manufacturability - Define procedures and metrologies - Generate engineering report base on studies and evaluation - Reporting of engineering studies...

Position title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages)Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor...

RESPONSIBILITIESManufacturing/ Production Line setup, pre-qualification and maintenance.Provide technical support to customer related to assembly/ manufacturing.Develop process and generate work instruction.Review drawing, customer specifications and Bill of Materials cleanup.Assembly, test, and commissioning of highly automated industrial equipments.Train,...

Semiconductor Packaging Module Design Engineer (TCB / Die Handling) Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for...

Be part of Die Bond Unit Process Development as Staff/Senior Staff Engineer - Front of Line Die Attach to develop and qualify the new assembly packages, process and ensure meeting design to cost & design manufacturing In your new role you will: - Be part of **Die Bond **Unit Process Development as Staff/Senior Staff Engineer - **Front of Line Die Attach...