Semiconductor Packaging Module Design Engineer
10 hours ago
Semiconductor Packaging Module Design Engineer (TCB / Die Handling) Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput. Key Responsibilities Must-have: Design & Development Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding. Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA). Planning, Scheduling and Costing of Machines Modules. Prototyping & Testing Oversee fabrication of prototype modules and their integration with TCB platforms. Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation. Process & Manufacturing Support Collaborate with Electrical, Vision and Software Engineers for the machine integration. Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls) Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems. Support
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TCB Design Engineer
5 days ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Street Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...
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TCB Design Engineer
10 hours ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty StreetWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...
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TCB Design Engineer
10 hours ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for...
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TCB Design Engineer
10 hours ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty StreetWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...
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Module Equipment Engineer
7 days ago
Singapore VISIONPOWER SEMICONDUCTOR MANUFACTURING COMPANY PTE. LTD. Full timeA leading semiconductor manufacturing company in Singapore is seeking a Module Associate Engineer to enhance tool performance in a 24/7 fab environment. The ideal candidate will have a diploma in relevant engineering fields and experience in a 300mm fab. Strong problem-solving abilities and teamwork skills are essential as you will conduct maintenance,...
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Module Associate Engineer
2 weeks ago
Singapore VISIONPOWER SEMICONDUCTOR MANUFACTURING COMPANY PTE. LTD. Full timeVISIONPOWER SEMICONDUCTOR MANUFACTURING COMPANY PTE. LTD. – Tampines VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC) is a new joint-venture 300mm semiconductor wafer manufacturing facility to be built in Singapore. We are looking for committed, resilient and passionate talents to launch a promising future that power the next generation...
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Scientist/Senior Scientist
2 weeks ago
Singapore A*STAR - Agency for Science, Technology and Research Full timeOverview Scientist/Senior Scientist (PECVD Module for Advance Packaging) (APM), IME Responsibilities Develop and optimize Plasma-Enhanced Chemical Vapor Deposition (PECVD) process for advanced packaging applications. Characterize thin film properties and troubleshoot process-related issues to ensure quality and performance. Serve as a subject matter expert,...
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TCB Design Engineer
10 hours ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor...
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Module Associate Engineer-WET
1 week ago
Singapore VISIONPOWER SEMICONDUCTOR MANUFACTURING COMPANY PTE. LTD. Full timeAbout VSMC VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC) is a new joint‐venture 300mm semiconductor wafer manufacturing facility to be built in Singapore. We are looking for committed, resilient and passionate talents to launch a promising future that power the next generation devices and systems. If you share the same passion to pursue...
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TCB Design Engineer
2 weeks ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages)Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor...
