Engineer (Die Bonding, Wire Bonding)

4 days ago


Singapore Amplus Communication Full time $50,000 - $80,000 per year

Responsibilities:

  • Develop and optimize bonding process parameters, including temperature, force, and time
  • Troubleshoot process deviations and work with customers on R&D requirements
  • Handle multi-tasks including Die Bonding, Wire Bonding, Optical alignment, and Rework processes

Requirements:

  • Minimum Diploma in Electronics / Mechatronic engineering
  • At least 2 years of engineering experience in an electronics manufacturing or related technical environment
  • Hands-on experience with Die Bonding, Wire Bonding
  • Ability to troubleshoot PCBA and perform mechanical assembly
  • Experience in maintaining and operating bonding machines
  • Ability to handle R&D customer requests
  • Knowledge of semiconductor packaging, advanced interconnects, or similar high-precision assembly would be an advantage
  • Ability to work independently and as part of a team

Job Types: Full-time, Permanent

Pay: $3, $4,800.00 per month

Work Location: In person



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